Business News • PR NewsWire • Fraunhofer IZM-ASSID Selects EV Group Temporary Bonding and Debonding Equipment for Developing Processes for High-Volume Manufacturing of 3D ICs

Fraunhofer IZM-ASSID Selects EV Group Temporary Bonding and Debonding Equipment for Developing Processes for High-Volume Manufacturing of 3D ICs

Fraunhofer IZM-ASSID Selects EV Group Temporary Bonding and Debonding Equipment for Developing Processes for High-Volume Manufacturing of 3D ICs

ST. FLORIAN, Austria, May 31 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary b

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